| Sponsor |
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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology
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| Sponsor |
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Inline Automatic X-Ray Inspection: TruViewâ„¢ Verus
TruViewâ„¢ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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| Ask the Experts |
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March 3, 2010 - Updated
March 1, 2010 - Originally Posted
When Should We Use Underfill?
We have a circuit board assembly with a wafer level chip scale package. The package is 2mm x 2mm with 20 solder balls (diameter 0.20 mm) and standoff is 0.16 mm.
Under what circumstances should we use underfill? What type of underfill material do you suggest?
T. S. Y.
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| Expert Panel Responses |
Wafer Level Packages (WLPs) should always be plasma treated (in order to improve underfill bonding, fluid flow and adhesion performance), and then underfilled in order to increase component reliability and lifetime—especially if the end product is a mobile product such as a cell phone, music player or other hand-held device.
If you need assistance in determining a suitable plasma treatment for your WLP application, Nordson MARCH can assist you. If you need advice in regard to underfill material dispensing, our sister companies Nordson ASYMTEK and Nordson EFD can be of service to you.
Scott D. Szymanski
Global Marketing Manager
Nordson MARCH
Mr. Szymanski works to expand strategic alliances, strengthen partnerships with equipment suppliers, and develop future product offerings tailored to the semiconductor market.
NOTE: Mr. Szymanski is no longer working at Nordson MARCH
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