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October 17, 2017 - Updated October 19, 2009 - Originally Posted Issues with BGA Components Near PCB EdgesWhat issues are we likely to see when we place BGA components very close to PCB edges? What impact might it have on reliability? Will equipment (screening, placement, reflow, etc.) require modification? T. B. |
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Expert Panel Responses | ||||||||
Thermal Profiling is the key to determine if you are going to have a reflow problem with a BGA, or any other component, near the board edge. A careful thermal profile of the board and BGA near the edge as compared to the middle of the board will need to be performed to characterize the nature of the oven near its rails. Many reflow machines run several degrees cooler near the rails, and as you know, this can make the difference between a good and bad BGA reflow process. Place T/Cs at all four corners of the BGA and one or two others at a BGA closer to the middle of the board and compare the resulting profile temperatures and times above liquidus. If you do not have the exact assembly for this characterization profile, then use most any scrap assembly with a similar component density, even cutting it to size in order to position a BGA near the edge of the board. This will let you know if the reflow process is going to give you problems. There are several ways to solve this problem in roughly descending cost order:
Senior Project Engineer Electronic Controls Design Inc Paul been with Electronic Controls Design Inc. (ECD) in Milwaukie, Oregon for over 39 years as a Senior Project Engineer. He has seen and worked with the electronic manufacturing industry from many points of view, including: technician, engineer, manufacture, and customer. His focus has been the design and application of measurement tools used to improve manufacturing thermal processes and well as moisture sensitive component storage solutions.
At least on the reflow front, you can use profiling as a tool to ensure you are reaching the correct peak temperatures for larger mass BGAs, while not frying more sensitive components on your board. Also remember across the belt uniformity can range anywhere from 2 to 5C+. Often the edges of your PCB is the coolest in the oven, therefore requiring even more heat for your BGAs to reflow correctly. This makes even more critical that you use profiling as a method to "balance" your board. For example if your BGAs are normally set to a max peak temp of 245C you might need to bump this up slightly, but you better keep a close eye on components like electrolytic capacitors. With some software like KIC2000, you can redefine these sensitive components, for example, lowering their max peak to 235C. I just posted today some great pictures to show you what is being used to measure uniformity across the belt from one oven manufacturer as well as examples of balancing your board with profiling. Global Account Manager Indium Corporation Mr. O'Leary is the Global Account Manager for Indium. He has and extensive global network of contacts in the electronics industry with expertise in SMT equipment and processes.
In regards to the stencil printer, you will have to make sure that depending on how close to the edge of the board you are talking about that any PCB clamping system that is present on the top side of the board during printing is designed to not affect stencil contact at the print point or you will need to ensure that your printer has the capability to pull the board flat and then retract any top side clamping system before printing. President EKRA America Mr. Hall has spent the last 20 years in the electronics manufacturing industry. He started at Motorola specializing in the development of screen printing and reflow soldering processes. He has became known as an expert in printing technology.
If your printer has board edge clamps you may need to put a relief pocket on bottom side of the stencil to assure good stencil to board gasketing in the area close to the edge of the board. Vice President Technology Photo Stencil For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.
From the PCB design side, with BGAs close to the edges, you may have problems routing the traces away from the component. From the reflow side, your higher mass BGA may require additional heat for reflow, as a result you may overheat the edges of your board during soldering. From the rework side, your BGA on the edge of the board may cause edge warping during rework of the BGA. Regional Sales Manager OK International Inc. Ed Zamborsky is a Regional Sales & Technical Support Manager for Thermaltronics, located in New York. His position requires frequent customer visits throughout North America and the Caribbean and his position encompasses not only sales but the role of trainer and master applications engineer for all of Thermaltronics products. His expertise includes such specialties as hand soldering, convection and conduction reflow techniques, array rework, fluid dispensing equipment, and fume extraction. Ed has authored many articles and has presented many papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead-Free Hand Soldering, High Thermal Demand Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.
When the PCB is post-assembly separated frompallet/panel form to individual form, the various methods of"depanelizing" will load different levels of stress along the PCBedges (e.g., V-Score vs. tab-rout, both individually and in combination). As SMD distance to board edge decreases, component solder jointsusceptibility to the mechanical stresses of depanelization increases. Can'tpredict joint force loading through modeling? Have your PCB house provide a"print & etch" sample for practical evaluation. President Circuit Connect, Inc. Bob has been in PCB design and fabrication since 1976. He has held elected positions with the SMTA, is a member of the MSD Council, has served as a committee member for various IPC standards and is a Certified IPC Trainer.
There are a number of other factors to consider whenplacing BGAs closer to the edge of the PWB other than those already mentioned.Here are some other considerations:
Advanced Engineer/Scientist General Dynamics Richard D. Stadem is an advanced engineer/scientist for General Dynamics and is also a consulting engineer for other companies. He has 38 years of engineering experience having worked for Honeywell, ADC, Pemstar (now Benchmark), Analog Technologies, and General Dynamics.
I would not stressthat much about this. However- few things to consider:
Engineering and Operations Management Independent Consultant Georgian Simion is an independent consultant with 20+ years in electronics manufacturing engineering and operations.
Contact me at georgiansimion@yahoo.com. |
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