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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
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| Ask the Experts |
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July 15, 2009 - Updated
July 13, 2009 - Originally Posted
Thermal cycle limit
How many thermal cycles can we expose a Class 3 printed wiring assemblies to before it will no longer maintain a Class 3 rating?
In general how many thermal cycles should we allow at a given location on a circuit board, such as at a BGA site, before we should consider the assembly compromised and thus may be unreliable at any Class rating?
P. W.
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| Expert Panel Responses |
You are mixing and matching terminologies. Class 3 is a manufacturing specification. Thermal cycling has nothing to do with manufacturing.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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