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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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| Ask the Experts |
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February 2, 2009 - Updated
February 1, 2009 - Originally Posted
High Tg PCB requirement
Do we need to use a High Tg PCB material for a double sided PCB that is 62 mils thick if the PCB will only see one solder reflow step?
D.Q.
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| Expert Panel Responses |
Are you trying to process lead free metal? Do you have small packages on the board. Lifting pads could be of concern if processing at 850 degrees F. I personally prefer to use the higher Tg material in all my designs and have never got in trouble with processing both lead free or good old leaded solder.
Take a look at VT-47 Datasheet for Lead Free Assemblies.
James Mahoney
Applications Project Manager
Quick Turn Flex Circuits LLC
James Mahoney is a Technical Operations Manager with a 20 year track record in managing new product introduction. He is a skilled leader, motivator and problem solver with a strong background in Product Knowledge and Engineering Management.
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