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Ask the Experts | |||||||
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September 6, 2017 - Updated August 10, 2008 - Originally Posted Wave Soldering ProblemsIn our circuit assembly production line, we are seeing many process defects that occur after wave soldering operations. The defects include; insufficient fill of PTH barrel and large voids within plated-through holes. We cannot determine what causes of these defects and don't know how to prevent them. Can you provide suggestions for avoiding these conditions and recommend corrective actions related to these kinds of defects? E.W. |
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Expert Panel Responses | |||||||
Insufficient hole filling and why? There are many many reasons for this and I would not know where to begin, but a more information would have been useful, such as board thickness, finished hole size, board plating material, flux type and flux application method and finally the type of solder being used in the wave solder machine, is it lead-free or leaded solder? Not knowing any of these items, check the following:
Vice President, Technical Director EPTAC Corporation At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.
There are several things that could cause insufficient fill of the PTH.
Manager of Assembly Technology IPC Kris Roberson has experience as a machine operator, machine and engineering technician and process engineer for companies including Motorola, and US Robotics. Kris is certified as an Master Instructor in IPC-7711 / 7721, IPC A-610 and IPC J-STD 001.
Lack of Dedrossing can be a key factor in the type of defects you describe. Dross is formed on the surface of the solder pot as it comes in contact in the air that we breathe. Similar to the tarnish on sterling silver turning dark, only this happens in a matter of hours in a hot solder pot. Performing dedrossing multiplet imes per 8 hour shift may reduce or eliminate the problem you describe. Visually looking at the surface of the solder pot you should see a clean shiny surface, if you see clumps of dull silver or particles floating you need to dedross. If the dross gets on to the solder joints you are likely to have failures. President & CEO - Retired Bliss Industries, Inc. Retired - Mr. Bliss has 20+ years experience creating process methods that improve profitability by maximizing hidden unused capacity and throughput. Ken has expertise in all areas of manufacturing specializing in electronics assembly.
Voids and insufficient top side fillet happened in PTH due to one or more of the following causes: Materials:
Managing Director, Asia Pacific ECD EH Lim has been in the PCB Assy industry since 1985, starting at Thomson/Singapore for 5 years before moving to Electrovert Asia Pacifc. Lim was Sales Director for Vitronics Soltec prior to joining ECD in 2007 as Managing Director for Asia Pacific.
It appears that there is probably not enough flux that is wetting the entire barrel including the top side. Better preheat may help reduce the voids that are forming. Also, if a flux with increased activity level is used, it could improve the capillary flow and wetting. President inspīre solutions LLC Bjorn Dahle is the President of inspīre solutions LLC. He has 20 years experience in the electronic manufacturing industry with various manufacturing equipment companies covering pick & place, screen printers and thermal process management.
Poor topside fillet can be caused by many points. I suggest the following:
Eastern Manager Vitronics Soltec John Norton started his soldering career in 1983 for Hollis Engineering. He has also worked with Electrovert as a technical training manager and Vitronics Soltec for the last ten years. He has held various technical development and sales positions.
Reader Comment
If you have already verified the WS parameters and setup and the materials used in the process are OK, you might want to take a look at the board design. There are some design constrains that make it difficult to achieve a good barrel fill:
Guillermo Flores, Jabil Circuit, Mexico
Reader Comment
I am surprised no one mentioned baking theboards to expel moisture trapped in the PCB. We have had great success eliminating voids at our LEAD FREE WAVE SOLDERby pre-baking boards and storing them in vacuum sealed bags. Keep in mind thatonce a board is baked, if left out in the open air, it will reabsorb 75% of themoisture you just baked out of it within 48 hours.
Once you bake the boards, you must build themthru the WAVE SOLDER process. Don't letbaked boards sit out all weekend in open air. They will absorb moisture andcome MONDAY you will see voids all over again!
Jon Fischer, Genesis Mfg, USA
Reader Comment
One problem we encountered was caused by the PWB fabricator. Solder mask was getting into the thruholes and preventing the solder from wetting up to the top of the hole. We found small amounts of what looked like uncured solder masking at the top of thruhole solder plugs. We analyzed it and sure enough it was uncured masking. We were fortunate enough to be able to slow down the PWB thru the wave bath and raise the wave pump to push solder up the thruholes. The solder mask was not cured in the holes, if it was, it would have been impossible to "wash" it out. Point is, verify the thruholes are clean.
Jerry Wiatrowski, General Dynamics
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