| Sponsor |
|
Electronic Assembly Cleaning Basics
Monitoring & effectively controlling chemistry concentration when cleaning electronic assemblies is crucial for maintaining optimal cleanliness results & preventing costly consequences.
KYZEN
|
|
| Sponsor |
|
Your award-winning cored wire supplier
As an industry-leading, full-line supplier of flux-cored wire solder, our award-winning solutions meet the needs of virtually every assembly and rework application.
Indium Corporation
|
|
| Ask the Experts |
|
|
August 21, 2006 - Updated
July 5, 2007 - Originally Posted
Small hole via plating reliability
Where would I find studies on small hole (.006"-.010" mechanical drill) via plating reliability?
R.O.
|
| Expert Panel Responses |
Plating reliability tends to be a function of hole size only with the respect to aspect ratio (board thickness/hole diameter). See IPC TR-579 for reliability predictions. However, you seem to be suggesting concerns with hole quality? Please feel free to contact me directly to help resolve your question.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
|
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Touchless Solder Ball Removal
Watch our video showcasing touch-free BGA component deballing. This revolutionary approach achieves unparalleled reliability and precision when preparing BGA components for re-balling.
Circuit Technology Center
|
|
|
