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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
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| Ask the Experts |
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August 21, 2006 - Updated
July 5, 2007 - Originally Posted
Small hole via plating reliability
Where would I find studies on small hole (.006"-.010" mechanical drill) via plating reliability?
R.O.
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| Expert Panel Responses |
Plating reliability tends to be a function of hole size only with the respect to aspect ratio (board thickness/hole diameter). See IPC TR-579 for reliability predictions. However, you seem to be suggesting concerns with hole quality? Please feel free to contact me directly to help resolve your question.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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