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Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD
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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch
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Ask the Experts |
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March 11, 2007 - Updated
July 4, 2007 - Originally Posted
Rigid and flex board assembly
We have some boards disconnected in transition zone: between rigid and flex segments. This happens during an assembly process. What is recommended to add to manufacture process in order to strengthen the area?
Anna Seredovaya
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Expert Panel Responses |
It seems like you are stating that you are having tearing of the flex circuit at the interface with the rigid board? And this is happening during manufacturing? During reflow, handling, or testing?
It would seem that this problem could be handled quite simply by ensuring good carrier design. Is there more to this that I'm missing?
Feel free to contact me directly with more details.
Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions
Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.
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Are you sitting comfortably?
Boost comfort and productivity! Discover how proper ergonomics can reduce strain, improve accuracy, and enhance performance for microscope users. Download now!
Vision Engineering
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